Course detail

Technology of Low Dimensional Structures

FSI-TNS Acad. year: 2027/2028 Summer semester

Overview of technologies for the fabrication of low-dimensional materials and nanostructures (0D, 1D, and 2D). Controlled and self-assembly processes for nanostructure formation; deposition, epitaxial growth, lithography, and etching methods. Analytical methods and techniques for the characterization of nanostructures and thin films. Physical principles underlying the technologies used and related phenomena at the nanoscale. Practical examples of material systems, heterostructures, and their applications in electronics and optoelectronics.

Language of instruction

Czech

Number of ECTS credits

3

Supervisor

prof. Ing. Miroslav Kolíbal, Ph.D.

Department

Institute of Physical Engineering

Entry knowledge

Basic knowledge of general physics, the structure and properties of solid-state materials, electronic transport phenomena, energy band diagrams, and the interaction of electromagnetic radiation with matter. Basic concepts of molecular and quantum physics.

Rules for evaluation and completion of the course

The course is concluded with a colloquium. During the colloquium, students are expected to demonstrate their understanding of the topics covered, their ability to explain the fundamental physical principles underlying individual methods for the fabrication of low-dimensional structures, and to discuss their advantages, limitations, and potential practical applications. Assessment is based on the scientific accuracy of the answers, understanding of the underlying relationships, and the ability to apply the acquired knowledge to specific examples. Students are allowed to use their own lecture notes when preparing for the colloquium.

Attendance at tutorials and laboratory sessions is compulsory and is monitored by the instructor. Any absences must be made up in a manner determined by the instructor, taking into account the scope and content of the missed classes.

The course is successfully completed upon fulfilment of the compulsory attendance requirements and successful completion of the colloquium.

Aims

Upon successful completion of the course, the student will be able to:

  • explain the fundamental physical principles of technologies used for the fabrication of low-dimensional structures (0D, 1D, and 2D materials);

  • distinguish between top-down and bottom-up approaches and describe their respective advantages and limitations;

  • describe the principles of selected deposition, epitaxial growth, lithography, and etching methods;

  • explain the fundamental principles of analytical methods used for the characterization of nanostructures and thin films;

  • assess the suitability of individual fabrication and characterization methods for specific material systems and applications;

  • provide examples of applications of low-dimensional materials and heterostructures in electronics and optoelectronics.

The study programmes with the given course

Programme B-FIN-P: Physical Engineering and Nanotechnology, Bachelor's, compulsory-optional

Type of course unit

 

Lecture

26 hours, compulsory

Syllabus

Lecture 1 – Introduction to low-dimensional structures, bottom-up and self-assembly. General introduction, quantum dots, fullerenes, nanowires, 2D materials, chemical approaches to growth, physical approaches to growth, self-assembly


Lecture 2 – Top-down technology, Hybrid approaches. SPM-based lithography, Resist based technology (optical and electron beam lithography), hybrid approaches to assembly)


Lecture 3 – Magnetron/Ion Beam sputtering, evaporation and spintronics. Different thin film growth strategies, ranging from evaporation to sputtering techniques. Epitaxial films and heterostructures. Semiconductor multilayer structures and magnetic recording media.


Lecture 4 – Molecular beam epitaxy. Molecular beam epitaxy will be explained with emphasis on applications in solid state lasers


Lecture 5 – Etching and Chemical Vapor Deposition. Wet and dry etching will be briefly discussed. Chemical Vapor Deposition will be explained, including doping in nanostructures and blue diode story.


Lecture 6 – Atomic Layer Deposition. The lecture will provide a brief overview of technology used in semiconductor industry. Most important technological landmarks will be introduced, with emphasis on Atomic Layer Deposition.


Lecture 7 – Focused Particle Beam enhanced lithography. Interactions of primary ions with condensed matter, focused ion beam system technology, micro- and nanofabrication, focused ion beam induced processes and general and special applications of FIB


Lecture 8 – Composition and structure of low dimensional structures. A general overview on the structural and composition analysis tools of thin films and nanostructures will be given, including x-ray diffraction, spectroscopic ellipsometry, SEM/TEM, and surface science analytical techniques with high spatial resolution.

Laboratory exercise

3 hours, compulsory

Syllabus



  1. Introduction to the laboratory environment, principles of working in cleanroom facilities, and safety regulations.




  2. Thin-film fabrication by thermal evaporation, optical lithography, and fundamental principles of pattern transfer into thin films.




  3. Electrical characterization of the fabricated structures and evaluation of the measured data.



Exercise

7 hours, compulsory

Syllabus



  1. Calculations and examples related to the formation and properties of low-dimensional structures.




  2. Physical principles of deposition methods and thin-film growth.




  3. Examples of the use of lithography, etching, and deposition in nanostructure fabrication.




  4. Principles of selected analytical methods and interpretation of their results.




  5. Practical examples of material systems, heterostructures, and their applications.



Computer-assisted exercise

3 hours, optionally

Syllabus

Utilized as a support for practical lessons.